6-Layer Hybrid PCB with RO4350B and High Tg FR-4 for RF Applications1.Product Introduction: Advanced Hybrid PCB Technology This innovative 6-layer hybrid PCB combines Rogers RO4350B high-frequency material with standard High Tg FR-4 (Tg170°C) in an optimized stackup, delivering superior RF performance while maintaining cost efficiency. The hybrid construction strategically places RO4350B (Dk=3.48±0.05) in critical signal layers for optimal high-frequency response, while utilizing cost-effective FR-4 for structural support and power distribution. This approach provides the perfect balance between RF performance, thermal reliability, and manufacturing economics for modern wireless systems. 2.Key Material Properties RO4350B Characteristics Dielectric Constant: 3.48±0.05 @10GHz High Tg FR-4 Features High Temp Resistance: Tg≥170°C 3.PCB Construction Specifications
4.PCB Stackup: Copper layer 1 - 35 μm 5.Board Statistics Components: 77 6.Manufacturing & Quality Standards Artwork Format: Gerber RS-274-X 7.Technical Advantages Performance Optimization: RO4350B for critical RF paths, FR-4 for power/cost 8.Target Applications Cellular Base Station Antennas and Power Amplifiers |
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