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6-Layer Hybrid PCB
PCB Material:RO4350B + High Tg FR-4 / 1.6mm
MOQ:1PCS
Price:24.99-199 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:11-17 working days
Payment Method:T/T, Paypal
 

6-Layer Hybrid PCB with RO4350B and High Tg FR-4 for RF Applications


1.Product Introduction: Advanced Hybrid PCB Technology

This innovative 6-layer hybrid PCB combines Rogers RO4350B high-frequency material with standard High Tg FR-4 (Tg170°C) in an optimized stackup, delivering superior RF performance while maintaining cost efficiency. The hybrid construction strategically places RO4350B (Dk=3.48±0.05) in critical signal layers for optimal high-frequency response, while utilizing cost-effective FR-4 for structural support and power distribution. This approach provides the perfect balance between RF performance, thermal reliability, and manufacturing economics for modern wireless systems.


2.Key Material Properties

RO4350B Characteristics

Dielectric Constant: 3.48±0.05 @10GHz
Ultra-Low Loss: 0.0037 dissipation factor @10GHz
Thermal Stability: 32 ppm/°C Z-axis CTE
Process Compatibility: Standard FR-4 fabrication
Flame Rating: UL 94 V-0 certified


High Tg FR-4 Features

High Temp Resistance: Tg≥170°C
Mechanical Strength: Excellent multilayer compatibility
Cost Efficiency: Traditional epoxy/fiberglass benefits
Lead-Free Compatible: Withstands high-temp soldering


3.PCB Construction Specifications

ParameterSpecification
Base MaterialRO4350B / Tg170 FR-4
Layer Count6-Layer
Board Dimensions155mm × 120mm (±0.15mm)
Minimum Trace/Space4/6 mils
Minimum Hole Size0.4mm
Via TypeThrough-Hole Only
Finished Thickness1.6mm
Copper Weight1oz (35μm) outer layers
Via Plating Thickness20μm
Surface FinishImmersion Silver
Top SilkscreenWhite
Bottom SilkscreenNone
Top Solder MaskGreen
Bottom Solder MaskGreen
Electrical Testing100% tested prior to shipment


4.PCB Stackup:

Copper layer 1 - 35 μm
RO4350B - 0.422 mm (16.6mil)
Copper layer 2 - 35 μm
Prepreg - 0.102mm
Copper layer 3 - 35 μm
Tg170°C FR-4 - 0.254mm
Copper layer 4 - 35 μm
PrePreg - 0.002mm
Copper layer 5 - 35 μm
Tg170°C FR-4 - 0.508mm
Copper layer 6 - 35 μm


5.Board Statistics

Components: 77
Total Pads: 276
Thru Hole Pads: 178
Top SMT Pads: 86
Bottom SMT Pads: 12
Vias: 213
Nets: 11


6.Manufacturing & Quality Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping


7.Technical Advantages

Performance Optimization: RO4350B for critical RF paths, FR-4 for power/cost
Thermal Reliability: Withstands lead-free reflow processes
Impedance Control: ±0.05 Dk tolerance in RF sections
Manufacturing Efficiency: Standard FR-4 processes throughout


8.Target Applications

Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNB's for Direct Broadcast Satellites


 

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